***********************************************************************
***********           PANJIT International Inc.             ***********
***********************************************************************
*Mar 22, 2019                                                         *
*                                                                     *
*This SPICE Model describes the characteristics of a typical device   *
*and does not respresent the specification. Designer should refer to  *
*the same type name data sheet for specification limits.              *
***********************************************************************
*$
.subckt 1SMB3EZ24 A K
.param
+vc0 = 2.372e-10	vc1 = 2.327e-12		vc2 = 2.267e-10		vc3 = 6.125e-2
+tc1 = 2.062e-2		tc2 = 8.234e-3		tc3 = 9.222e-3		tc4 = 4.634e-3
d1 A K zener
g1 K A value = {(vc0+vc1*v(K,A)^2)*(1.0+tc1*(temp-25)*exp(tc2*(temp-25)))+(vc2*exp(vc3*v(K,A)))*(1.0+tc3*(temp-25)*exp(tc4*(temp-25)))}
.model zener d
***** flag parameter ***
+level = 1   
***** dc model parameter ***
+ is = 1.068e-14	   n = 1.045		  rs = 1.831e-2		ikf = 1.681
+ibv = 31e-3		 nbv = 1		  bv = 24
***** capacitance parameter ***
+cjo = 1.632e-10	   m = 3.316e-1		  vj = 6.682e-1
+ fc = 0.5                      
***** temperature coefficient ***
+tnom = 25		  eg = 1.113		 xti = 3
+trs1 = 3.024e-4	tbv1 = 9.025e-4		tbv2 = -2.826e-7
.ends 1SMB3EZ24
*$
